Wafer-level packaging mechanisms

A semiconductor package comprising:

• a molding compound surrounding a first semiconductor die;
• a first conductive pad on the first semiconductor die, wherein the first conductive pad is at a top metal level of the first semiconductor die;
• and
• a redistribution line (RDL) over the first conductive pad, wherein the RDL extends over a top surface of the molding compound, and a portion of the RDL is electrically connected to the first conductive pad, and a surface of the first conductive pad electrically connected to the portion of the RDL is at a different level from the top surface of the molding compound.

A semiconductor package comprising:

• a first semiconductor die;
• a second semiconductor die spaced from the first semiconductor die;
• a first conductive pad on the first semiconductor die;
• a second conductive pad on the second semiconductor die;
• a dielectric layer surrounding the first semiconductor die and the second semiconductor die;
• a redistribution line (RDL) electrically connected to the first conductive pad and to the second conductive pad, wherein the RDL extends over a top surface of the dielectric layer, and a surface of the first conductive pad electrically connected to the portion of the RDL is at a different level from the top surface of the dielectric layer.