Semiconductor device and method for manufacturing the semiconductor device
AssigneeFujitsu Semiconductor Limited
InventorsTakeshi Imamura, Nobutaka Shimizu, YASUNORI FUJIMOTO
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Abstract
A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.
Claims14
A method for manufacturing a semiconductor device, comprising:
- mounting a first element on a wiring substrate;
- placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element;
- attaching the first heat sink to the first element via the metal material by heating and melting the metal material;
- and
- mounting a second element on the wiring substrate after attaching the first heat sink to the first element.
A semiconductor device comprising:
- a wiring substrate;
- a processing unit mounted on the wiring substrate;
- a regulator mounted on the wiring substrate;
- a first heat sink attached onto the processing unit via a metal material;
- and
- a second heat sink attached to the regulator via a resin material.
Dependencies are inferred from the claim text.