Semiconductor Module and Method for Manufacturing Semiconductor Module

A semiconductor module comprising:

• a case including a receiving space which is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween, the pair of wall portions including a heat dissipation portion and a support wall which supports the heat dissipation portion at the frame portion;
• a plurality of semiconductor device blocks which are disposed in parallel in the receiving space while facing the wall portion, wherein a conductor plate is joined to each of electrode surfaces formed at both sides of a semiconductor device;
• a plurality of insulating sheet members which are respectively interposed between the respective conductor plates and an inner periphery of the wall portion to insulate the respective conductor plates and the inner periphery of the wall portion;
• and
• a resin composition member which is filled in the receiving space to seal the plurality of semiconductor device blocks,
• wherein
• the heat dissipation portion provided at least one side of the wall portion includes a plurality of separate heat dissipation portions disposed to face the plurality of semiconductor device blocks respectively, and
• the plurality of separate heat dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat dissipation portion inside the case such that the plurality of insulating sheet members is closely joined to the plurality of conductor plates and the plurality of separate heat dissipation portions respectively.