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US 2014/0197531 A1Published application
Compact device package
AssigneeAnalog Devices, Inc.
InventorDavid Bolognia
Life of this patent
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Abstract
Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements.
Claims35
An integrated device package comprising:
- a carrier having at least two walls angled relative to one another;
- a substrate coupled to the carrier, the substrate having a first bend and a second bend;
- a first integrated device die mounted to a first side of the substrate between the first bend and the second bend;
- and
- a second integrated device die mounted to a second side of the substrate between the first bend and the second bend, the second side opposite the first side.
2 more elements
An integrated device package comprising:
- a carrier;
- a substrate having at least one bend and coupled to the carrier, the substrate including a first segment that defines at least part of an exterior surface of the integrated device package;
- a first integrated device die mounted to the substrate;
- and
- a first interfacing feature formed on the first segment of the substrate.
2 more elements
An integrated device package comprising:
- a carrier having at least two walls angled relative to one another, the at least two walls defining a package housing;
- a substrate coupled to the carrier, the substrate having at least one bend within the housing, the bend separating first and second segments;
- a first integrated device die mounted to a first side of the first segment of the substrate;
- and
- a second integrated device die mounted to a second side of the first segment of the substrate, the first side opposite the second side.
2 more elements
A method for manufacturing an integrated device package, the method comprising:
- providing a carrier having at least two walls angled relative to one another;
- mounting a first integrated device die to a first side of a substrate;
- mounting a second integrated device die to a second side of the substrate, the second side opposite the first side,
- bending the substrate in a first direction to form a first bend;
- bending the substrate in a second direction to form a second bend, the second direction opposite the first direction;
- and
- coupling a segment of the substrate to a first wall of the carrier,
- wherein the first integrated device die and the second integrated device die are mounted between the first bend and the second bend.
5 more elements
Dependencies are inferred from the claim text.