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US 2014/0197527 A1Published application
Chip arrangement and a method for manufacturing a chip arrangement
AssigneeInfineon Technologies AG
InventorsManfred Mengel, Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz
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Abstract
A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.
Claims27
A chip arrangement, comprising:
- a carrier;
- a first chip electrically connected to the carrier;
- a ceramic layer disposed over the carrier;
- and
- a second chip disposed over the ceramic layer;
- wherein the ceramic layer has a porosity in the range from 3% to 70%.
3 more elements
A method for manufacturing a chip arrangement, the method comprising:
- electrically connecting a first chip to a carrier;
- disposing a ceramic layer having a porosity in the range from 3% to 70% over the carrier;
- and
- disposing a second chip over the ceramic layer.
1 more element
Dependencies are inferred from the claim text.