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US 2014/0197523 A1Published application
Chip arrangement and a method for forming a chip arrangement
AssigneeInfineon Technologies AG
InventorsRalf Otremba, Marco Seibt
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Abstract
A chip arrangement is provided, the chip arrangement, including: a carrier; at least one chip including at least one contact pad disposed over the carrier; an encapsulation material at least partially surrounding the at least one chip and the carrier; and at least one low temperature co-fired ceramic sheet disposed over a side of the carrier.
Claims23
A chip arrangement, comprising:
- a carrier;
- at least one chip comprising at least one contact pad disposed over the carrier;
- an encapsulation material at least partially surrounding the at least one chip and the carrier;
- and
- at least one low temperature co-fired ceramic sheet disposed over a side of the carrier.
2 more elements
A method for forming a chip arrangement, the method comprising:
- disposing at least one chip comprising at least one contact pad over a carrier;
- at least partially surrounding the at least one chip and the carrier with an encapsulation material;
- and
- disposing at least one low temperature co-fired ceramic sheet over a side of the carrier.
1 more element
Dependencies are inferred from the claim text.