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US 2014/0197512 A1Published application
Semiconductor device
AssigneeRohm Co., Ltd.
InventorOkimoto Kondo
Life of this patent
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Abstract
A semiconductor device includes a substrate with first and second lower electrodes, a semiconductor element supported on the substrate and including upper and lower electrodes, a conductive bonding material bonding the lower electrode of the element and the substrate to each other, a wire connecting the upper electrode of the element and the substrate to each other, and a sealing resin covering the semiconductor element and the wire. The substrate includes a barrier that encloses at least partially the conductive bonding material.
Claims29
A semiconductor device comprising:
- a substrate including a first substrate lower surface electrode and a second substrate lower surface electrode;
- a semiconductor element supported on the substrate, the semiconductor element including an element upper surface electrode and an element lower surface electrode;
- a conductive bonding material bonding the element lower surface electrode and the substrate to each other;
- a wire connecting the element upper surface electrode and the substrate to each other;
- and
- a sealing resin covering the semiconductor element and the wire;
- wherein the substrate includes a barrier that encloses at least partially the conductive bonding material.
4 more elements
Dependencies are inferred from the claim text.