Semiconductor device and method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, the method comprising:

• providing an organic substrate;
• providing an integrated circuit and a chip part on the organic substrate;
• forming a molded section including a central portion and a peripheral portion, and forming, as a whole, a concave shape, the central portion sealing the integrated circuit and the chip part on the organic substrate, and the peripheral portion standing around the central portion;
• and
• providing a solid-state image pickup element on the central portion of the molded section, the solid-state image pickup element having a top edge that is lower in position in a thickness direction than a top edge of the peripheral portion of the molded section.