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US 2014/0197503 A1Published application
Sensor package
AssigneeInfineon Technologies AG
InventorsRalf Wombacher, Horst Theuss
Life of this patent
Estimating the term…
Abstract
A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements.
Claims20
A semiconductor package comprising:
- a carrier;
- a semiconductor sensor coupled to the carrier;
- and
- a protective layer made of an oxide material covering at least a portion of the semiconductor sensor.
1 more element
A semiconductor device comprising:
- a carrier;
- a semiconductor sensor comprising a bottom side and a side wall adjoining the bottom side, the semiconductor sensor coupled to the carrier such that the bottom side faces the carrier;
- wire-bonds electrically connecting the carrier with the semiconductor sensor;
- a protective layer made of organic semiconductor material including an oxide, covering at least a portion of the semiconductor sensor and directly contacting the wire-bonds;
- and
- wherein a second portion of the protective layer is in direct contact with the side wall of the semiconductor sensor, and where the protective layer has a thickness in the range of 5 nm to 400 nm.
3 more elements
A sensor device, comprising:
- a carrier;
- a semiconductor sensor mounted on the carrier and having an active surface and a side wall;
- contact elements electrically connecting the carrier with the semiconductor sensor;
- a protective layer made of an oxide material covering at least the active surface and directly contacting the contact elements;
- and
- wherein a second portion of the protective layer is in direct contact with the side wall of the semiconductor sensor where the protective layer has a thickness in the range of 5 nm to 400 nm.
3 more elements
Dependencies are inferred from the claim text.