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US 2014/0197501 A1Published application
MEMS Device with Polymer Layer, System of a MEMS Device with a Polymer Layer, Method of Making a MEMS Device with a Polymer Layer
AssigneeInfineon Technologies AG
InventorAlfons Dehe
Life of this patent
Estimating the term…
Abstract
A MEMS device, a method of making a MEMS device and a system of a MEMS device are shown. In one embodiment, a MEMS device includes a first polymer layer, a MEMS substrate disposed on the first polymer layer and a MEMS structure supported by the MEMS substrate. The MEMS device further includes a first opening disposed in the MEMS substrate and a second opening disposed in the first polymer layer.
Claims26
A MEMS device comprising:
- a first polymer layer;
- a substrate disposed on the first polymer layer;
- a MEMS structure supported by the substrate;
- a first opening disposed in the substrate;
- and
- a second opening disposed in the first polymer layer.
3 more elements
A system comprising:
- a carrier;
- an aperture disposed in the carrier;
- a MEMS device disposed on the aperture;
- and
- a cap covering the MEMS device, wherein the MEMS device comprises a perforation in a first polymer layer, the perforation overlying the aperture.
2 more elements
A system comprising:
- a carrier;
- a MEMS device disposed on the carrier, the MEMS device comprising a first polymer layer;
- and
- a cap covering the MEMS device.
1 more element
20-25. (canceled)
A MEMS device comprising:
- a first polymer layer;
- a semiconductor substrate disposed on the first polymer layer;
- a MEMS structure supported by the semiconductor substrate;
- a first opening disposed in the semiconductor substrate;
- and
- a second opening disposed in the first polymer layer.
3 more elements
Dependencies are inferred from the claim text.