Trench silicide and gate open with local interconnect with replacement gate process
AssigneeAdvanced Micro Devices, Inc.
InventorRichard T. Schultz
Life of this patent
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AssigneeAdvanced Micro Devices, Inc.
InventorRichard T. Schultz
Estimating the term…
A semiconductor device fabrication process includes forming insulating mandrels over replacement metal gates on a semiconductor substrate with first gates having sources and drains and at least one second gate being isolated from the first gates. Mandrel spacers are formed around each insulating mandrel. The mandrels and mandrel spacers include the first insulating material. A second insulating layer of the second insulating material is formed over the transistor. One or more first trenches are formed to the sources and drains of the first gates by removing the second insulating material between the insulating mandrels. A second trench is formed to the second gate by removing portions of the first and second insulating materials above the second gate. The first trenches and the second trench are filled with conductive material to form first contacts to the sources and drains of the first gates and a second contact to the second gate.
A semiconductor device, comprising:
A computer readable storage medium storing a plurality of instructions which, when executed, generate a semiconductor device that comprises:
Dependencies are inferred from the claim text.