Semiconductor device and manufacturing method thereof
AssigneeKabushiki Kaisha Toshiba
InventorMasafumi HAMAGUCHI
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AssigneeKabushiki Kaisha Toshiba
InventorMasafumi HAMAGUCHI
Estimating the term…
A semiconductor device includes a substrate, and a gate electrode formed on the substrate on a gate insulation film. The semiconductor device also includes a source diffusion layer and a drain diffusion layer which are formed on the substrate where the gate electrode is sandwiched between the source diffusion layer and the drain diffusion layer, one or more source contacts formed on the source diffusion layer; and one or more drain contacts formed on the drain diffusion layer. At least one of the source contacts and the drain contacts includes a first contact region having a first size and a second contact region having a second size larger than the first size on the same source diffusion layer or on the same drain diffusion layer.
A semiconductor device, comprising:
A manufacturing method of a semiconductor device, comprising:
A manufacturing method of a semiconductor device, comprising:
Dependencies are inferred from the claim text.