Semiconductor device having dual parallel channel structure and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsChang-yong UM, Jai-kwang SHIN
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AssigneeSamsung Electronics Co., Ltd.
InventorsChang-yong UM, Jai-kwang SHIN
Estimating the term…
A semiconductor device may include a substrate having a drift region doped to a first conduction type. A trench may be etched into an upper surface of the substrate. A gate may be arranged along side walls of the trench. A gate oxide layer may be between the side walls of the trench and gate and between a bottom surface of the trench and gate. A first source region of the first conduction type may be on the upper surface of the substrate. A second source region of the first conduction type may be on the bottom surface of the trench. A first well region may be between the first source region and drift region, and a second well region may be between the second source region and drift region, the first and second well regions being doped to a second conduction type (electrically opposite to the first conduction type).
A semiconductor device, comprising:
A method of fabricating a semiconductor device, comprising:
Dependencies are inferred from the claim text.