Light emitting diode device and method for manufacturing heat dissipation substrate
AssigneeEcocera Optronics Co., Ltd.
InventorHung-Pin Lee
Life of this patent
Estimating the term…
Abstract
The light emitting diode (LED) device includes a substrate formed with at least one electrode; an LED chip disposed on the substrate, and formed with at least one solder pad; at least one wire electrically connected between the solder pad and the electrode; and a fluorescent material layer covering the LED chip. Thermal conductivity of the substrate is 80˜120 W/mK and a color rendering index of the LED device under correlated color temperatures 2600K˜3700K is greater than 90.
Claims15
A light emitting diode (LED) device comprising:
- a substrate including at least an electrode;
- an LED chip disposed on the substrate and including at least a solder pad;
- at least a wire electrically connected between the solder pad and the electrode;
- and
- a fluorescent material layer covering the LED chip;
- wherein thermal conductivity of the substrate is 80˜120 W/mK, and a color rendering index of the LED device under correlated color temperatures 2600K˜3700K is greater than 90.
A light emitting diode (LED) device comprising:
- an LED chip, having a first side and a second side opposite thereto;
- a first electrode and a second electrode respectively formed on a first area and a second area of the first side;
- a first solder pad and a second solder pad, located on a surface of a substrate, wherein the first solder pad is electrically connected to the first electrode and the second solder pad is electrically connected to the second electrode;
- a first pad and a second pad located on another surface of the substrate;
- a first conductive rod located in the substrate and connecting the first solder pad and the first pad;
- a second conductive rod located in the substrate and connecting the second solder pad and the second pad;
- and
- a fluorescent material layer covering the second side of the LED chip;
- wherein thermal conductivity of the substrate is 80˜120 W/mK, and a color rendering index of the LED device under correlated color temperatures 2600K˜3700K is greater than 90.
A method for manufacturing a heat dissipation substrate of a lighting element, comprising steps of:
- a) providing a substrate with thermal conductivity of 80˜120 W/mK;
- b) performing a roughening process to the substrate;
- and
- c) forming a circuit pattern on the substrate to serve as the heat dissipation substrate for the lighting element.
Dependencies are inferred from the claim text.