Substrate free led package

A method of fabricating a substrate free light emitting diode (LED), comprising:

• arranging a plurality of LED dies on a tape to form an LED wafer assembly;
• molding an encapsulation structure over at least one of the plurality of LED dies on a first side of the LED wafer assembly;
• removing the tape;
• and
• singulating the LED wafer assembly into predetermined regions comprising at least one LED.

A method of fabricating a substrate free light emitting diode (LED), comprising:

• arranging a plurality of LED dies on a tape to form an LED wafer assembly, the plurality of LED dies comprising die contacts;
• molding an encapsulation structure over at least one of the plurality of LED dies on a first side of the LED wafer assembly;
• removing the tape to expose the die contacts;
• electrically coupling at least one die contact from a first die with at least one die contact from a second die;
• and
• singulating the LED wafer assembly into predetermined regions comprising at least the electrically coupled first die and second die.

A substrate free light emitting diode (LED), comprising:

• an LED die having at least one contact;
• a dielectric layer formed over at least one of the LED dies on a first side of the LED;
• an oversized contact region on the dielectric layer, the oversized contact region electrically coupled to the at least one contact;
• and
• an encapsulation structure on a second side of the LED die.

A substrate free light emitting diode (LED), comprising:

• a plurality of LED dies, each die having at least one contact;
• a dielectric layer formed over at least two of the LED dies on a first side of the LED;
• an oversized contact region on the dielectric layer, the oversized contact region electrically coupled to the at least one contact for each of the two dies;
• and
• an encapsulation structure on a second side of the LED die, the encapsulation structure covering the at least two LED dies, wherein the at least two LED dies are electrically coupled.