Method For Manufacture Of A Multi-Layer Plate Device

A method for the manufacture of a multi-layer plate device used in semiconductor processing, said method comprising the steps of:

• arranging a plurality of plate components into a stack, wherein said plurality of plate components comprise an upper plate layer, a lower plate layer, and a brazing layer disposed between said upper plate layer and said lower plate layer;
• and
• joining said upper plate layer to said lower plate layer,
• wherein said step of joining said upper plate layer to said lower plate layer comprises the steps of:
• placing said stack in a process chamber;
• removing oxygen from said process chamber;
• heating the stack of plate components while in the process chamber with the oxygen removed;
• and
• joining said upper plate layer to said lower plate layer while maintaining a minimum joint thickness.