Compositions for controlled assembly and improved ordering of silicon-containing block copolymers

A lithography system comprising:

• a substrate comprising at least one layered material;
• a mask composition disposed over the substrate;
• wherein the mask composition comprises:
• (a) a block copolymer including:
• an organosilicon block;
• an organic block;
• and
• one or more moieties comprising a hydrogen bond donor or a hydrogen bond acceptor;
• and
• (b) an organic additive including one or more moieties comprising a hydrogen bond acceptor or a hydrogen bond donor, wherein:
• hydrogen bonds formed between the moieties in the block copolymer and the moieties in the organic additive produce ordered arrangements of atoms in the composition.

A method for forming structures having features between 5 and 100 nm in size comprising the steps of:

• (a) forming a layer of a mask material over a substrate comprising a plurality of layered materials, wherein the mask material comprises a block copolymer composition including:
• an organosilicon block;
• an organic block;
• and
• one or more moieties comprising a hydrogen bond donor or a hydrogen bond acceptor;
• and
• an organic additive including one or more moieties comprising a hydrogen bond acceptor or a hydrogen bond donor, wherein:
• hydrogen bonds formed between the moieties in the block copolymer and the moieties in the organic additive produce ordered arrangements of atoms in the composition;
• (b) annealing the mask material on the substrate;
• (c) exposing the mask material to an etching process selected for its ability to selectively etch the organic block and the organic additive of the block copolymer composition, wherein the etching process exposes a layer of the substrate;
• and
• (d) exposing the substrate material to a second etching process selected for its ability to etch the layer of substrate exposed by step (c);
• so that structures having features between 5 and 100 nm in size are formed.