Substrate processing method and substrate processing apparatus

A substrate processing apparatus for processing a substrate comprising:

• a substrate holding rotating unit for holding the substrate and rotating the substrate about a rotational axis passing through a principal face of the substrate;
• an etching liquid supply mechanism including a nozzle for discharging an etching liquid toward the principal face of the substrate held by the substrate holding rotating unit;
• a nozzle moving mechanism for moving a liquid application position, the etching liquid discharged out of the nozzle being applied thereon, within the principal face of the substrate;
• and
• a control device for controlling the substrate holding rotating unit, the etching liquid supply mechanism, and the nozzle moving mechanism,
• wherein the control device carries out:
• a scan velocity determining step of determining a moving velocity for moving a liquid application position from an edge portion of the principal face of the substrate to the center portion of the principal face of the substrate according to a supply condition of the etching liquid under a state that the liquid application position is positioned at the center portion of the principal face of the substrate;
• a scan step of rotating the substrate about an rotational axis passing through the principal face of the substrate and moving the nozzle while discharging the etching liquid such that the liquid application position is moved from the edge portion of the principal face of the substrate to the center portion of the principal face of the substrate;
• and
• a center discharging step of rotating the substrate about the rotational axis while continuing the discharge of the etching liquid toward the principal face of the substrate under the state that the liquid application position being positioned at the center portion of the principal face of the substrate.