Copper electroplating solution and copper electroplating apparatus

An apparatus for electroplating copper on a substrate, comprising:

• a plating chamber containing an electroplating solution, the electroplating solution including,
• an aqueous electrolyte solution having water soluble copper salts, sulfide ions and chloride ions,
• an accelerator having an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction,
• a suppressor having a polyether compound, the suppressor selectively suppressing the copper reduction, and
• a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution;
• a dispersion plate uniformly dispersing the electroplating solution in the plating chamber and providing copper ions to the electroplating solution;
• a substrate holder electrically connected to the dispersion plate and to which a substrate is secured;
• and
• a solution provider providing the electroplating solution into the plating chamber.

An electroplating solution comprising:

• an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions;
• and
• a leveler including one of an N-vinyl pyrrolidone compound represented by Chemical Formula (1), a diallyldimethyl ammonium chloride (DADMAC) represented by Chemical Formula (2) and a copolymer of DADMAC and N-vinyl pyrrolidone represented by Chemical Formula (3),
• wherein each of R21 and R22 denote a C1-C4 unsubstituted alkyl group.