Electroplating aid board and electroplating device using same

Abstract

An electroplating device includes a plating solution, at least one anode basket located in the plating solution, and a workpiece to be plated. An electroplating aid board is arranged between the anode basket and the workpiece to be plated. The electroplating aid board has at least one side that has a length exceeding the workpiece to be plated. The electroplating aid board is made of a plastic material that is not electrically conductive and includes a plurality of holes formed therein. In an electroplating operation, the holes provide an effect of tunnel that guides positive ions (such as copper ions) of the plating solution to flow from the anode basket (namely anode) straightforward to the nearest surface portion of the workpiece to be plated.

Dependencies are inferred from the claim text.