Method for producing a receptacle for a sensor element

A method for producing a sensor arrangement, comprising:

• introducing a first amount of a pre-ceramic substance into an injection mold;
• forming a base layer of the receptacle by molding the pre-ceramic substance in the injection mold;
• applying at least one conductor track to the base layer;
• introducing a further amount of a pre-ceramic substance into an injection mold onto at least a partial region of the base layer and of the at least one conductor track;
• forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold;
• debinding and sintering the molded body;
• and
• applying a sensor element to a receiving region of the receptacle.

A receptacle for a sensor element, the receptacle produced by a method including:

• introducing a first amount of a pre-ceramic substance into an injection mold;
• forming a base layer of the receptacle by molding the pre-ceramic substance in the injection mold;
• applying at least one conductor track to the base layer;
• introducing a further amount of a pre-ceramic substance into an injection mold onto at least a partial region of the base layer and of the at least one conductor track;
• forming a top region of the receptacle directly on the base layer while at least partially covering over the at least one conductor track by molding the further pre-ceramic substance in the injection mold;
• and
• debinding and sintering the molded body.