Multilayer ceramic capacitor, mounting board therefor, and manufacturing method thereof

Amounting board for a multilayer ceramic capacitor, the mounting board comprising:

• a printed circuit board having first and second electrode pads formed thereon;
• and
• a multilayer ceramic capacitor installed on the printed circuit board,
• wherein the multilayer ceramic capacitor includes:
• a ceramic body in which a plurality of dielectric layers are stacked;
• a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic body;
• first and second external electrodes formed on both end surfaces of the ceramic body, electrically connected to the respective first and second internal electrodes, and having lower surfaces connected to the first and second electrode pads by solder;
• and
• first and second non-conductive epoxy resin layers formed on peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes to allow the solder not to be formed thereon.

A manufacturing method of a multilayer ceramic capacitor, the manufacturing method comprising:

• preparing a plurality of ceramic sheets;
• forming first and second internal electrodes on at least one surfaces of the plurality of ceramic sheets;
• stacking the plurality of ceramic sheets on which the first and second internal electrodes are formed to form a stack;
• cutting the stack while allowing one ends of the first and second internal electrodes to be alternately exposed to both end surfaces of the stack, respectively;
• sintering the cut stack to form a ceramic body having the plurality of first and second internal electrodes;
• forming first and second external electrodes, using a conductive paste, on both end surfaces of the ceramic body to be electrically connected to exposed portions of first and second internal electrodes, respectively;
• and
• applying a non-conductive epoxy resin to peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes to form first and second non-conductive epoxy resin layers.