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US 2014/0196878 A1Published application
Thermal dissipater apparatus for use with electronic devices
AssigneeResearch In Motion Limited
InventorsMartin Earl Holman, IV, Patrick Yves Mas, Rohit Koppal
Life of this patent
Estimating the term…
Abstract
Thermal dissipater apparatus for use with electronic devices. An example heat dissipater apparatus disclosed herein includes a body defining a lateral wall. A first wall projects from an inner surface of the lateral wall to define a first cavity, and a second wall projects from the inner surface of the lateral wall to define a second cavity. The first wall isolates the first cavity from the second cavity.
Claims20
A thermal dissipater shield apparatus comprising:
- a body defining a lateral wall;
- a first wall projecting from an inner surface of the lateral wall defining a first cavity;
- and
- a second wall to project from the inner surface of the lateral wall defining a second cavity, the first wall is spaced apart from the second wall, and the first cavity is isolated from the second cavity.
1 more element
An assembly comprising:
- a thermal dissipater shield having a first wall defining a first cavity and a second wall defining a second cavity, the first cavity is separated from the second cavity, the thermal dissipater having a lateral wall extending over the first wall and the second wall to define the first cavity and the second cavity;
- and
- a thermal gel to be applied in the first cavity and across substantially an entire surface area of the lateral wall.
A method comprising:
- coupling a thermal dissipater shield to a substrate of an electronic device, the heat dissipater shield having a lateral wall and a first cavity;
- capturing an integrated circuit chip positioned on the substrate in the first cavity when the thermal dissipater shield is coupled to the substrate, the first cavity isolating the integrated circuit chip from discrete components surrounding the integrated circuit, the lateral wall providing a surface area that is greater than a surface area defined by the integrated circuit;
- applying a thermal gel in the first cavity of the heat dissipater shield to substantially cover all surfaces of the integrated circuit that are in communication with the first cavity;
- and
- applying the thermal gel to an outer surface of the lateral wall.
2 more elements
Dependencies are inferred from the claim text.