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US 2014/0196854 A1Published application
Separating apparatus
AssigneeE Ink Holdings Inc.
InventorsTsung-Ting Lee, Chin-Chi Yu
Life of this patent
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Abstract
A separating apparatus, including a base and a wire, is provided. The base is adapted for carrying an electronic device. The electronic device includes a first substrate, a second substrate, and an adhesive layer. The adhesive layer adheres the first substrate and the second substrate to each other. The wire is configured on the base. A wire diameter of the wire is equal to or greater than a thickness of the adhesive layer.
Claims11
A separating apparatus, comprising:
- a base carrying an electronic device comprising a first substrate, a second substrate, and an adhesive layer adhering the first substrate and the second substrate to each other;
- and
- a wire configured on the base, wherein a wire diameter of the wire is equal to or greater than a thickness of the adhesive layer.
Dependencies are inferred from the claim text.