Method For Detaching A Semiconductor Chip From A Foil

Method for detaching semiconductor chips from a foil, the method comprising a setup phase for determining and setting time periods which each defines a duration of a prepeeling step of the detachment process, wherein during each prepeeling step firstly at least one area of the semiconductor chip remains sticked to the foil and is bent and afterwards detaches from the foil, the setup phase comprising the following steps:

• illuminating a semiconductor chip to be removed with light which impinges substantially perpendicularly onto the surface of the semiconductor chip;
• carrying out the following steps for each prepeeling step whose duration is to be determined:
• initiating the prepeeling step;
• repeating the two steps:
• recording of an image of the semiconductor chip and assigning a time period to the image which has passed since the initiation of the prepeeling step, and
• checking whether in the image a peripheral region of the semiconductor chip is darker than a predetermined brightness value;
• until the check leads to the result that no peripheral region of the semiconductor chip is darker than the predetermined brightness value;
• and
• assigning to the prepeeling step the time period associated with the last recorded image or a time period derived therefrom.