Method and device for bonding two wafers
OwnerErich Thallnerinventor
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Abstract
A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers (2, 3), wherein a bond pressure is applied in succession to partial sections of the joining surface V.
Claims10
A device for bonding of two wafers on one joining surface V of the wafers, said device comprising:
- a pressure transfer means having a pressure surface D for applying a bond pressure to the wafers on the pressure surface D,
- wherein the pressure surface D is smaller than the joining surface V and said pressure transfer means applies the bond pressure in succession to partial sections of the joining surface V.
A method for bonding two wafers on one joining surface V of the two wafers, wherein said method comprises:
- acting on the two wafers using pressure transfer means with a pressure surface D, and
- applying a bond pressure in succession to partial sections of the joining surface V.
Dependencies are inferred from the claim text.