Subfloor component and method of manufacturing same

A method of manufacturing a subfloor component, comprising:

• providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
• placing heat-expandable beads into the mold against the pedestal-forming structures;
• applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
• placing a substantially moisture-impervious film into the mold adjacent to the pedestal-forming structures;
• applying heat to the mold to fuse the film to the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto;
• removing the panel with the fused film from the mold;
• and
• attaching a hardboard layer to the second face of the panel.

A method of manufacturing a subfloor component, comprising:

• providing a mold configured to form an insulating foam panel, the mold including pedestal-forming structures for forming the panel to have, in cross-section, a plurality of pedestals with walls that extend into the panel from a first face of the panel toward a second opposing face of the panel;
• placing heat-expandable beads into the mold against the pedestal-forming structures;
• applying heat to the mold to expand the heat-expandable beads to form the panel, wherein the expansion of the heat-expandable beads causes the expanding beads to enter into and conform to the pedestal-forming structures thereby to form the pedestals of the panel;
• removing the panel from the mold;
• placing a substantially moisture-impervious film adjacent the first face of the panel;
• applying heat to one or both of the film and the panel, the heat causing the film to enter into and conform to the pedestals and fuse thereto;
• and
• attaching a hardboard layer to the second face of the panel.