Method of manufacturing thick-film electrode
AssigneeE.I. du Pont de Nemours and Company
InventorsKazushige ITO, Kazutaka OZAWA
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Abstract
A method of manufacturing a thick-film electrode comprising steps of: (a) applying a conductive paste onto a substrate comprising, (i) 100 parts by weight of a conductive powder, wherein the conductive powder is 16 to 49 weight percent based on the weight of the conductive paste; (ii) 0.5 to 10 parts by weight of a metal additive comprising bismuth (Bi); (iii) 1 to 25 parts by weight of a glass frit; and (iv) 50 to 300 parts by weight of an organic medium; and (b) firing the applied conductive paste to form the thick-film electrode, wherein thickness of the thick-film electrode is 0.5 to 15 μm.
Claims12
A method of manufacturing a thick-film electrode comprising steps of:
- (a) applying a conductive paste onto a substrate, the conductive paste comprising,
- (i) 100 parts by weight of a conductive powder, wherein the conductive powder is 16 to 49 weight percent based on the weight of the conductive paste;
- (ii) 0.5 to 10 parts by weight of a metal additive comprising bismuth (Bi);
- (iii) 1 to 25 parts by weight of a glass frit;
- and
- (iv) 50 to 300 parts by weight of an organic medium;
- and
- (b) firing the applied conductive paste to form the thick-film electrode, wherein thickness of the thick-film electrode is 0.5 to 15 μm.
A conductive paste to form a thick-film electrode with thickness of 0.5 to 15 μm comprising:
- (i) 100 parts by weight of a conductive powder, wherein the conductive powder is 18 to 45 weight percent based on the weight of the conductive paste,
- (ii) 0.5 to 10 parts by weight of a metal additive comprising bismuth (Bi),
- (iii) 1 to 25 parts by weight of a glass frit, and
- (iv) 50 to 300 parts by weight of an organic medium.
Dependencies are inferred from the claim text.