Digital embossing
AssigneeFloor Iptech AB
InventorsDarko PERVAN, Tony PERVAN
Life of this patent
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Abstract
A method of forming a digital embossing (17) on a surface (2) by bonding hard press particles (67) to a carrier (68). A liquid binder pattern (P) is applied on the carrier by a digital drop application head. Hard press particles (67) are applied on the carrier (68) and the binder pattern such that some hard press particles are bonded to the carrier (68) by the liquid pattern and non-bonded press particles (67) are removed. The carrier (68) with the bonded hard press particles (67) is pressed to the surface (2) and an embossing is formed when the carrier (68) with the hard press particles (67) is removed.
Claims11
A method of forming a digital embossing on a surface by bonding hard press particles to a carrier, the method comprising the steps of:
- providing a liquid binder pattern on the carrier by a digital drop application head that applies a liquid substance on the carrier;
- applying the hard press particles on the carrier and the liquid binder pattern such that at least some hard press particles are bonded to the carrier by the liquid binder pattern;
- removing non-bonded hard press particles from the carrier;
- pressing the carrier with the bonded hard press particles to the surface;
- and
- removing the carrier with the bonded hard press particles from the pressed surface.
A press matrix for forming an embossed structure on a panel, wherein the press matrix comprises hard press particles arranged in a pattern and bonded to a carrier being a coated paper or a foil.
Dependencies are inferred from the claim text.