Method and Device for Purging Bubbles in the Pipeline of Substrate Coater and Corresponding Substrate Coater

A substrate coater, which can purge the bubbles in the pipeline, at least comprising a pipeline of the substrate coater, a nozzle connected to the pipeline of the substrate coater, and a device for purging bubbles in the pipeline, wherein the device for purging bubbles in the pipeline comprises:

• an injection pump, which is used to inject a photoresist into the pipeline of the substrate coater from a storage container;
• a controlling unit, which is used to activate the injection pump for a first time, driving the photoresist to flow in the pipeline of the substrate coater and proceeding a purging bubbles process once;
• after finishing the purging bubbles process, closing the injection pump for a second time;
• and after the small bubbles in the pipeline of the substrate coater accumulate in the second time, activating the injection pump again and repeating the purging bubbles process, until all small bubbles in the pipeline of the substrate coater being purged.

A method for purging bubbles in the pipeline of a substrate coater, wherein it at least comprises:

• activating an injection pump for a first time, the injection pump injecting a photoresist into the pipeline of the substrate coater from a storage container;
• driving the photoresist to flow in the pipeline of the substrate coater and proceeding a purging bubbles process once;
• closing the injection pump for a second time after finishing the purging bubbles process;
• and
• activating the injection pump again and repeating the purging bubbles process until all small bubbles in the pipeline of the substrate coater are purged after the small bubbles in the pipeline of the substrate coater accumulate in the second time.