Pressure measuring instrument and substrate processing apparatus provided with the pressure measuring instrument
AssigneeTokyo Electron Limited
InventorSatoru KOIKE
Life of this patent
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AssigneeTokyo Electron Limited
InventorSatoru KOIKE
Estimating the term…
There is provided a pressure measuring instrument including: a detecting unit including the reference pressure chamber therein and formed in a cylindrical shape, the diaphragm being disposed inside the detecting unit; a communicating unit for providing communication between the diaphragm and the measurement pressure chamber, and formed in a circular tube shape having an inner diameter smaller than an inner diameter of the detecting unit; and an annular flow-path forming unit disposed between the detecting unit and the communicating unit, and configured to form a substantially annular path. The communicating unit introduces a gas of the measurement pressure chamber into the substantially annular path. The annular flow-path forming unit allows the gas introduced from the communicating unit to pass through the substantially annular path and to supply the passing gas to a side surface of the diaphragm.
A pressure measuring instrument that, using a diaphragm disposed between a reference pressure chamber and a measurement pressure chamber, detects a deformation of the diaphragm and consequently measures a pressure of the measurement pressure chamber, the pressure measuring instrument comprising:
Dependencies are inferred from the claim text.