Two-axis vertical mount package assembly

A vertical mount package assembly comprising:

• a base substrate having electrical connections for affixing to external circuitry;
• a package having a device region configured to receive at least one device;
• a plurality of flexible electrical leads between the base substrate and the package,
• wherein the base substrate and the package each include beveled edges configured to mate when the base substrate and package are substantially orthogonal to one another.

A method of manufacturing a vertical mount package assembly, the method comprising:

• providing a base, wherein the base includes electrical connections for affixing to external circuitry;
• providing a package, wherein the package includes a device region configured to receive at least one device;
• providing flexible electrical leads between the base and the package, wherein the flexible leads include aligned grooves;
• and
• rotating the package relative to the base substrate, wherein aligned grooves constrain the relative positions of the substrates during rotation, and wherein the flexible electrical leads maintain the connection between the base substrate and the package after rotation.