Glass substrate with sealing material layer, organic el device using same, and manufacturing method for electronic device

A glass substrate with a sealing material layer, comprising a sealing material layer formed by sintering a sealing material, wherein:

• the sealing material comprises at least inorganic powder;
• the inorganic powder comprises glass powder and a refractory filler;
• a content of the refractory filler in the inorganic powder is 10 to 35 vol %;
• and
• the sealing material layer has a surface roughness Ra of less than 0.5 μm.

A glass substrate with a sealing material layer, comprising a sealing material layer formed by sintering a sealing material, wherein:

• the sealing material comprises at least inorganic powder;
• the inorganic powder comprises glass powder and a refractory filler;
• a content of the refractory filler in the inorganic powder is 10 to 35 vol %;
• and
• the sealing material layer has a surface roughness RMS of less than 1.0 μm.

A method of producing an electronic device by laser sealing, the method comprising the steps of:

• preparing a glass substrate;
• mixing a sealing material comprising glass powder and a vehicle comprising an organic binder to manufacture a sealing material paste;
• applying the sealing material paste onto the glass substrate to form a coating layer;
• firing the coating layer to yield a glass substrate with a sealing material layer;
• laminating the glass substrate with a sealing material layer and a glass substrate without a sealing material layer, via the sealing material layer;
• and
• irradiating the laminate with laser light so that a laser sealing temperature is equal to or lower than a firing temperature to hermetically seal the glass substrate with a sealing material layer and the glass substrate without a sealing material layer.