Sonotrode with cutting mechanism
AssigneeFéinics AmaTech Teoranta
InventorDavid Finn
Life of this patent
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Abstract
During mounting to an inlay substrate, at least one end portion (including end) of an antenna wire is positioned directly over a terminal of the chip module for subsequent connecting thereto. A sonotrode is disclosed with a cutter above the capillary for cutting or nicking the wire. Insulation may be removed from a portion of the wire. The antenna may comprise two separate stubs, each having an end portion (including end) positioned over a terminal of the chip module. Additional techniques for mounting the antenna wire are disclosed.
Claims11
A sonotrode for mounting an antenna wire to an inlay substrate for a transponder, comprising:
- a capillary having an internal bore through which the wire passes;
- a clamping mechanism for holding the wire relative to the capillary;
- a cutting mechanism for at least partially severing the wire;
- wherein:
- the cutting mechanism is disposed above the capillary.
A method of embedding a wire in a substrate comprising:
- feeding the wire past a cutting mechanism, through a capillary of a sonotrode, onto the substrate.
Dependencies are inferred from the claim text.