Low impedance oxide resistant grounded capacitor for an aimd

A hermetically sealed filtered feedthrough assembly for an implantable medical device, the filtered feedthrough assembly comprising:

• an insulator hermetically sealed to a conductive ferrule;
• a conductor hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule between a body fluid side and a device side;
• a feedthrough capacitor located on the device side, the feedthrough capacitor comprising a first and a second end metallization, wherein the first end metallization is connected to at least one active electrode plate and wherein the second end metallization is connected to at least one ground electrode plate, wherein the at least one active electrode plate is interleaved and disposed parallel to the at least one ground electrode plate, wherein the at least one active and ground electrode plates are disposed within a capacitor dielectric;
• a first low impedance electrical connection between the first end metallization and the conductor;
• an oxide-resistant metal addition attached directly to the ferrule;
• and
• a second low impedance electrical connection coupling the second end metallization electrically and physically directly to the oxide-resistant metal addition.

A hermetically sealed filtered feedthrough assembly for an implantable medical device, the filtered feedthrough assembly comprising:

• a ferrule comprising a conductive peninsula or extension;
• an insulator hermetically sealed to the conductive ferrule;
• a conductor hermetically sealed and disposed through the insulator in non-conductive relation to the conductive ferrule between a body fluid side and a device side;
• a feedthrough capacitor located on the device side, the feedthrough capacitor comprising a first and a second end metallization, wherein the first end metallization is connected to at least one active electrode plate and wherein the second end metallization is connected to at least one ground electrode plate, wherein the at least one active electrode plate is interleaved and disposed parallel to the at least one ground electrode plate, wherein the at least one active and ground electrode plates are disposed within a capacitor dielectric;
• a first low impedance electrical connection between the first end metallization and the conductor;
• a ground conductor disposed through the feedthrough capacitor in non-conductive relation with the at least one ground and active electrode plates, where the ground conductor is electrically coupled to the conductive peninsular or extension;
• and
• an oxide-resistant metal addition attached directly at one end to the ground conductor and connected at the other end to the second end metallization of the feedthrough capacitor.