Method of manufacturing head chip

A method of manufacturing a head chip, the head chip comprising an actuator plate having a plurality of ejection grooves arranged on a first surface of an actuator substrate, each of the grooves having a depth penetrating the actuator substrate, and a nozzle plate placed on a second surface of the actuator plate, the nozzle plate having a plurality of nozzle holes arranged thereon, each of the nozzle holes communicating with a middle part in the longitudinal direction of each of the ejection grooves,

• the method comprising:
• a groove forming step for forming grooves which are bases of the ejection grooves on the first surface of the actuator substrate;
• a substrate grinding step for grinding a second surface of the actuator substrate so that each of the grooves has a predetermined depth;
• a recessed portion forming step for forming at least one inspection recessed portion on the actuator substrate, the at least one inspection recessed portion changing its state in the second surface of the actuator substrate according to a grinding amount of the actuator substrate in the substrate grinding step;
• and
• a grinding amount determination step for determining the grinding amount of the actuator substrate on the basis of a state of the at least one inspection recessed portion after the substrate grinding step.