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US 2014/0193953 A1Published application
Method of manufacturing semiconductor device mounting structure
AssigneeFujitsu Limited
InventorsManabu WATANABE, Masateru KOIDE, Kenji FUKUZONO, Takashi KANDA
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Abstract
A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.
Claims1
A method of manufacturing a semiconductor device mounting structure, the method comprising:
- providing an opening in a substrate;
- forming a groove around the opening;
- providing a frame member in the groove, the frame member having a frame body and a protruding portion that protrudes from the frame body;
- bonding an adhesive sheet on the substrate around the frame member;
- filling through holes formed in the adhesive sheet with conductive ink;
- providing a coreless substrate on the adhesive sheet;
- and
- providing semiconductor elements on the coreless substrate.
5 more elements
Dependencies are inferred from the claim text.