Stacked semiconductor package including connections electrically connecting first and second semiconductor packages

A method of fabricating a stacked semiconductor package, the method comprising:

• providing a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first, package substrate, the first package substrate having lateral first and second sides constituting the outer peripheral region thereof;
• providing a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate;
• and
• forming a plurality of connections between an outer region of the top surface of the first package substrate outside the first semiconductor chip and a region of the bottom surface of the second package substrate corresponding to the outer region,
• wherein a first group of the connections is provided along, the first side of the first package substrate as spaced from one another, and the heights of the connections of the first group are varied from a central to an outer region of the first side.

A method of fabricating a stacked semiconductor package, the method comprising:

• providing a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first package substrate, the first package substrate having a first side constituting an outer peripheral region thereof, wherein the first semiconductor chip is surrounded by a mold except for a top surface of the first semiconductor chip,
• providing a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate;
• and
• forming a plurality of connections electrically connecting the first semiconductor package and the second semiconductor package, the connections being disposed outside the first semiconductor chip along the outer peripheral region of the first package substrate, and
• wherein a first group of the connections is disposed along the first side of the first package substrate as spaced from one another, and the heights of the connections of the first group vary from a central to an outer region of the first side.