Low void solder joint for multiple reflow applications

A solderable assembly, comprising

• a die having a solderable surface;
• a heat spreader having a solderable surface positioned such that the solderable surface of the heat spreader is facing the solderable surface of the die;
• and
• a solder thermal interface material disposed between the solderable surface of the die and the solderable surface of the heat spreader, wherein at least one of the solderable surface of the die and the solderable surface of the heat spreader comprises a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material;
• wherein the solderable assembly is configured to be heated in the presence of an inert oxide reducing gas under a first temperature profile to melt the solder thermal interface material thereby attaching the die to the heat spreader to form a soldered assembly, wherein the sacrificial metallization layer comprises a first metal soluble in the solder thermal interface material to form a eutectic composition with the second metal in the solder thermal interface material and create a package capable of undergoing subsequent reflow processes at equal or elevated temperature profiles.