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AssigneeAsahi Kasei E-Materials Corporation
InventorsYamato Saito, Juri Iwama, Toru Katsumata, Yuka Sasaki, Masashi Kimura, Harumi Matsuda
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The present invention relates to a photosensitive alkali-soluble silicone resin composition comprising an alkali-soluble silicone resin (A) which comprises a carboxyl group or a dicarboxylic acid anhydride group in one molecule; an alkali-soluble resin (B) whose acid value is between 10 mgKOH/g and 200 mgKOH/g; and a photoinitiator (C). The (A) or (B) ingredient may comprise a photosensitive unsaturated double bond group, or the photosensitive alkali-soluble silicone resin composition may further comprise a compound (D) which comprises a photosensitive unsaturated double bond.
A photosensitive alkali-soluble silicone resin composition comprising:
The photosensitive alkali-soluble silicone resin composition according toclaim 1 or 2, which contains:
A cured product obtained by curing a resin composition comprising (G) a polyorganosiloxane, (H) an alkali-soluble resin except for said polyorganosiloxane (G), and (C) a photopolymerization initiator, wherein the three-dimensional crosslinking degree (T) as calculated from the integration ratio in the solid 29Si-NMR spectrum of said cured product according to following formula (IV) is 0.2 or less:
A cured product obtained by curing a resin composition comprising (G) a polyorganosiloxane, (H) an alkali-soluble resin except for said polyorganosiloxane (G), and (C) a photopolymerization initiator, wherein the three-dimensional crosslinking degree (T′) as calculated from the integration ratio in the solid 29Si-NMR spectrum of said cured product according to following formula (V) is 0.45 or less:
Dependencies are inferred from the claim text.