Method for producing a reflective optical element for euv-lithography
AssigneeCarl Zeiss SMT GmbH
InventorsAlexey KUZNETZOV, Michael GLEESON, Robbert W. E. VAN DE KRUIJS, Frederik BIJKERK
Life of this patent
Estimating the term…
Loading patent…
AssigneeCarl Zeiss SMT GmbH
InventorsAlexey KUZNETZOV, Michael GLEESON, Robbert W. E. VAN DE KRUIJS, Frederik BIJKERK
Estimating the term…
A method aleviating blistering, cracking and chipping in topmost layers of a multilayer system exposed to reactive hydrogen, when producing a reflective optical element (50) having a maximum reflectivity at an operating wavelength of 5 nm to 20 nm. A multilayer system (51) composed of 30-60 stacks (53) is applied to a substrate (52). Each stack has a layer (54) of thickness dMLs composed of a high refractive index material and a layer (55) of thickness dMLa composed of a low refractive index material. The thickness ratio is dMLa/(dMLa+dMLs)=ΓML. Two to five further stacks (56) are applied to the multilayer system. at least one further stack having a layer (54) of thickness ds composed of a high refractive index material and a layer (55) of thickness da composed of a low refractive index material, wherein the thickness ratio is da/(da+ds)=Γ and wherein Γ≠ΓML.
A method for producing a reflective optical element for extreme ultraviolet (EUV) lithography, which element has a maximum reflectivity at an operating wavelength in the range of 5 nm to 20 nm, comprising:
Dependencies are inferred from the claim text.