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US 2014/0193232 A1Published application
Apparatus for flipping semiconductor device
AssigneeEpistar Corporation
InventorsChih-Wei WEI, Chia-Liang HSU
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Abstract
An apparatus for flipping a semiconductor device comprises a platform comprising a carrier and a roller system, a positioning unit above the platform and comprising a circular opening, and an elevating unit connecting the platform and the positioning unit.
Claims19
An apparatus for flipping a semiconductor device, comprising:
- a platform comprising a carrier and a roller system;
- a positioning unit above the platform and comprising a circular opening;
- and
- an elevating unit connecting the platform and the positioning unit.
1 more element
An operation method of an apparatus for flipping a semiconductor device, wherein the apparatus for flipping a semiconductor device comprises:
- a platform comprising a carrier and a roller system;
- a positioning unit above the platform and comprising a circular opening;
- an elevating unit connecting the platform and the positioning unit;
- a ring;
- and
- an adhesive substance attached to the ring;
- wherein the operation method comprises steps of:
- setting the positioning unit at a starting position;
- fixing a semiconductor device on the adhesive substance attached to the iron ring;
- fixing the ring to the positioning unit;
- setting the positioning unit to a predetermined position;
- flipping the semiconductor device;
- returning the positioning unit to the starting position;
- and
- taking out the semiconductor device which has been reversed.
12 more elements
Dependencies are inferred from the claim text.