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US 2014/0193121 A1Published application
Electromagnetic Isolating Ball Spring
AssigneeCisco Technology, Inc.
InventorsJoyce J.M. Peternel, Yong M. Jeon
Life of this patent
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Abstract
A device including a port barrel, a ball spring, a first enclosure part, and a mounting plate disposed adjacent to the first enclosure part is disclosed. The mounting plate includes a mounting hole. The port barrel is arranged to extend through the mounting hole, and the ball spring is arranged between an inner surface of the mounting hole and an exterior surface of the port barrel.
Claims23
An apparatus comprising:
- a port barrel;
- a ball spring;
- a first enclosure part;
- and
- a mounting plate disposed adjacent to the first enclosure part and comprising a mounting hole,
- wherein:
- the port barrel is arranged extending through the mounting hole, and
- the ball spring is arranged between an inner surface of the mounting hole and an exterior surface of the port barrel.
5 more elements
A method comprising:
- extending a port barrel through a mounting hole of a mounting plate, wherein the mounting plate is disposed adjacent to a first enclosure part;
- arranging a ball spring between an inner surface of the mounting hole and an exterior surface of the port barrel;
- and
- placing a second enclosure part in sealing contact with the first enclosure part such that the port barrel is at least partially enclosed by the first enclosure part and the second enclosure part.
1 more element
A method comprising:
- combining an electro-optical sub-assembly with an optical port barrel comprising a double flange;
- electrically connecting a printed circuit board to the electro-optical sub assembly;
- electromagnetically isolating a printed circuit board, wherein electromagnetically isolating the printed circuit board comprises:
- arranging the printed circuit board and the electro-optical sub-assembly within a first enclosure part;
- extending the port barrel through a mounting hole of a mounting plate, wherein the mounting plate is disposed adjacent to the first enclosure part;
- arranging a ball spring between an inner surface of the mounting hole and an interior of the double flange;
- and
- placing a second enclosure part in sealing contact with the first enclosure part such that the printed circuit board and the electro-optical sub-assembly are enclosed by the first enclosure part, the second enclosure part, the mounting plate, the ball spring and the port barrel.
5 more elements
Dependencies are inferred from the claim text.