Backlight Module, Printed Circuit Board Used for Backlight Module, and Manufacturing Method for The Same

A printed circuit board for a backlight module, wherein, the printed circuit board comprising:

• a light bar region used for mounting a light bar of the backlight module, being formed with a conductive circuit for supplying power for the light bar;
• and
• a heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot.

A manufacturing method for a printed circuit board of a backlight module, wherein, manufacturing method comprises:

• etching and patterning a conductive layer on a light bar region used for mounting the light bar and disposed on the printed circuit board to form a conductive circuit for supplying power to the light bar, and etching and cleaning a conductive layer on a heat dissipating region used for heat dissipation and disposed on the printed circuit board;
• cutting a connection location between the light bar region and the heat dissipating region to form a cutting slot, wherein the cutting slot is located at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot.