Reducing impedance of a printed circuit board through a square wave pattern of plated-through holes

A connected first printed circuit board and second printed circuit board comprising:

• a first printed circuit board comprising a square wave pattern along an edge of the first printed circuit board;
• a second printed circuit board comprising a square wave pattern along a corresponding edge of the second printed circuit board;
• a plurality of plated-through holes along the square wave pattern, a top section, and a bottom section of the connected first printed circuit board and second printed circuit board;
• a first metal clip securing the top section of the connected first printed circuit board and second printed circuit board;
• and
• a second metal clip securing the bottom section of the connected first printed circuit board and second printed circuit board.

A method for decreasing an impedance of a printed circuit board, comprising:

• forming a square wave pattern of an edge of the first printed circuit board and forming a complementary square wave pattern of a corresponding edge of the second printed circuit board;
• adjoining the first printed circuit board and the second printed circuit board, such that the square wave pattern of the edge of the first printed circuit board complements the square wave pattern of the corresponding edge of the second printed circuit board;
• producing a plurality of plated-through holes along the square wave pattern of the adjoined first printed circuit board and second printed circuit board and along a top section and a bottom section of the adjoined first printed circuit board and second printed circuit board;
• securing the top section of the adjoined first printed circuit board and second printed circuit board using a first metal clip and securing the bottom section of the adjoined first printed circuit board and second printed circuit board using a second metal clip;
• and
• connecting the first printed circuit board to the second printed circuit board to form a connected first printed circuit board and second printed circuit board by soldering along the square wave pattern using a wave soldering process.