Method of Electrophoretic Depositing (EPD) a Film on an Exposed Conductive Surface and an Electric Component Thereof

A method for manufacturing a packaged component, the method comprising:

• placing a component on a component carrier;
• encapsulating with an encapsulation body at least a portion of the component and the component carrier;
• and
• electrophoretic co-depositing organic molecules and inorganic elements thereby forming an insulating film on a conductive surface of the component, the component carrier or the encapsulation body.

A packaged component comprising:

• a component carrier;
• a component disposed on the component carrier;
• an encapsulation body at least partially encapsulating the component carrier and the component;
• and
• an insulating layer disposed on a heat sink of the component carrier, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.