Semiconductor device and printed circuit board

A semiconductor device, comprising:

• a first interposer on which a first semiconductor element is mounted;
• multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer;
• a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer;
• and
• multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
• wherein, in a case where, among four grid points that form a minimum unit grid of one of the multiple first ball electrodes closest to a corner of the first interposer,
• three grid points excluding a grid point closest to the corner of the first interposer are projected on the second interposer,
• the first interposer and the second interposer positioned at a grid point in a region surrounded by two straight lines passing through a projection point farthest from a corner of the second interposer closest from the corner of the first interposer among three projection points and through remaining two projection points, respectively, and by two side edges which are intersected with each other at the corner of the second interposer are not connected to second ball electrodes joined to each other.

A printed circuit board, comprising:

• a printed wiring board;
• a semiconductor device on which the semiconductor device is mounted;
• a first interposer on which a first semiconductor element is mounted;
• multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer and joined to the printed wiring board;
• a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer;
• and
• multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
• wherein, the first interposer and the second interposer are not joined to each other at a corner grid point closest to a corner of the second interposer.

A printed circuit board, comprising:

• a printed wiring board;
• a semiconductor device on which the semiconductor device is mounted;
• a first interposer on which a first semiconductor element is mounted;
• multiple first ball electrodes, which are arrayed at grid points of matrix on one surface of the first interposer and joined to the printed wiring board;
• a second interposer on which a second semiconductor element is mounted, the second interposer being stacked on the first interposer;
• and
• multiple second ball electrodes, which are arrayed at grid points of matrix on a surface of the second interposer facing the first interposer, for joining the second interposer to the first interposer,
• wherein, in a case where, among four grid points that form a minimum unit grid of one of the multiple first ball electrodes closest to a corner of the first interposer, three grid points excluding a grid point closest to the corner of the first interposer are projected on the second interposer, the first interposer and the second interposer positioned at a grid point in a region surrounded by two straight lines passing through a projection point farthest from a corner of the second interposer closest from the corner of the first interposer among three projection points and through remaining two projection points, respectively, and by two side edges which are intersected with each other at the corner of the second interposer are not connected to second ball electrodes joined to each other.