Mobile computing device dock station with headset jack heat pipe interface

An electronic communications system, comprising:

• an electronic communications device being operable for mobile phone communications while generating heat, said electronic communications device having a housing for at least partially enclosing electrical components including a printed circuit board (PCB), at least one battery operatively connected to said PCB for powering said PCB, a headset jack operatively connected to said PCB, a processor operatively connected to said PCB;
• an internal power charger operatively connected to said PCB for receiving an external battery charger to charge said battery, a radio frequency (RF) power amplifier (PA) operatively connected to said PCB;
• and a electronic communications device-heat sink providing a electronic communications device-heat collector;
• and at least one thermal shield comprising a thermal coupler for thermally coupling at least one of said components to said electronic communications device-heat sink to conduct and dissipate at least some heat generated by said components to said electronic communications device-heat sink, and said electronic communications system having at least one antenna for emitting and receiving electrical signals;
• said headset jack being useable in a headset position for connection to a an audible device;
• and being useable in a heat transfer position for transferring heat from said electronic communications device-heat sink;
• an electronic communications holder for receiving and holding said electronic communications device, said electronic communications holder comprising an electronic communications holder-heat sink and heat exchanger providing an electronic communications holder-heat collector for collecting and dissipating heat from said electronic communications device;
• and
• a heat transfer device comprising a heat pipe for transferring heat from said electronic communications device-heat sink to said electronic communications holder-heat sink, said heat transfer device having an inner end for connection to said headset jack and said electronic communications device-heat sink in said heat transfer position and having an outer end for connection to said electronic communications holder-heat sink in said heat transfer position.

An electronic communications system, comprising:

• a mobile electronic communications device being operable for mobile phone communications, said mobile electronics communications device having a modular housing for at least partially enclosing electrical components for performing functions of said mobile electronics communications device while generating heat, said electrical components including a printed circuit board (PCB), at least one battery operatively connected to said PCB for powering said components, a headset jack operatively connected to said PCB, a processor providing an applications processor comprising a central processing unit (CPU) including an integrated circuit (IC) chip operatively connected to said PCB;
• a battery voltage regulator providing an internal power charger and adapter operatively connected to said PCB for receiving an external battery charger to charge said battery;
• a radio frequency (RF) power amplifier (PA) operatively connected to said PCB;
• said mobile electronic communications device having a mobile electronic communications device-heat sink providing a mobile electronic communications device-heat collector comprising an internal heat sink thermally connected to said components including said headset jack, processor, power charger and RF PA;
• and said mobile electronics communications device having at least one antenna for transmitting and receiving electrical signals;
• said headset jack being useable in a headset position for connection to an audible device selected from the group consisting of a headset, head phone, ear plugs, ear buds, earset, earpiece, audibly receiver, audible transmitter, audible transceiver, and combinations of any of the preceding and being useable in a heat transfer position for transferring heat generated by said components in said electronic communications device;
• a mobile electronic communications device-receiving holder assembly comprising a mobile electronic communications device-receiving holder for receiving and holding said mobile electronics communications device, said electronic communications device-receiving holder assembly having a mobile electronic communications holder-heat sink providing a electronic communications holder-heat collector comprising an external heat sink for collecting and dissipating heat from said electrical components and mobile electronics communications device-heat sink providing said internal heat sink in said electronic communications device;
• and
• an external heat transfer device comprising an elongated external heat pipe providing an external thermal conduit for transferring and dissipating heat from said internal heat sink comprising said mobile electronics communications device-heat collector of said mobile electronics communications device to said external heat sink comprising said mobile electronics communications holder-heat sink of said mobile electronics communications device-receiving holder assembly, said elongated heat transfer device having an inner end comprising a headset jack-connector providing a headset jack-heat pipe interface for connection to said headset jack and said internal heat sink comprising said mobile electronics communications device-heat collector in said heat transfer position and having an outer end comprising an external heat sink-connector providing a heat pipe-electronic communications holder-heat sink interface for connection to said external heat sink comprising said mobile electronics communications holder-heat sink of said electronic communications holder.