Cooling apparatus with a resilient heat conducting member

A computer memory system comprising:

• a substrate;
• a plurality of electronic modules connected to said substrate, wherein said plurality of electronic modules are disposed parallel relative to one another and vertically relative to said substrate;
• and
• a plurality of cooling structures, wherein each of said plurality of cooling structures is disposed between an adjacent pair of said plurality of electronic modules, each of said cooling structures comprising:
• a thermally conducting central element having a channel formed therein, said channel being configured for flow of cooling fluid there through;
• a first thermally conductive resilient member contacting said thermally conducting central element;
• a second thermally conductive resilient member contacting said thermally conducting central element, wherein said second thermally conductive resilient member is disposed opposite said first thermally conductive resilient member with respect to said thermally conducting central element;
• a first pressure plate contacting said first thermally conductive resilient member opposite said thermally conducting central element, wherein said first pressure plate, said first thermally conductive resilient member, and said thermally conducting central element form a first heat transfer path away from a first electronic module of said adjacent pair of said plurality of electronic modules;
• and
• a second pressure plate contacting said second thermally conductive resilient member opposite said thermally conducting central element, wherein said second pressure plate, said second thermally conductive resilient member, and said thermally conducting central element form a second heat transfer path away from a second electronic module of said adjacent pair of said plurality of electronic modules.

A method of cooling an electronic module comprising:

• providing a cooling structure disposed in contact with said electronic module;
• providing a cooling fluid flowing through a channel;
• and
• cooling said electronic module by conducting heat of said electronic module through said cooling structure and to said cooling fluid flowing through said channel, wherein said cooling structure comprises a thermally conductive resilient member forming a heat transfer path between said electronic module and said cooling fluid flowing through said channel.