Composite chassis for lowering surface temperature

An information handling system (IHS), comprising:

• an IHS chassis including an outer surface and defining an IHS housing;
• a processor located in the IHS housing;
• a memory coupled to the processor and located in the IHS housing:
• a first layer of the IHS chassis that provides the outer surface of the IHS chassis and includes a first layer oxidized surface located opposite the first layer from the outer surface of the IHS chassis;
• and
• a second layer of the IHS chassis that is located immediately adjacent the IHS housing, wherein the second layer includes a carbide-based composite material and that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the chassis base.

A method for providing an IHS chassis, comprising:

• providing a first layer for a chassis base, wherein the first layer includes an outer surface of the chassis base;
• oxidizing a first surface of the first layer that is located opposite the first layer from the outer surface of the chassis base to provide a first layer oxidized surface;
• providing a second layer for the chassis base, wherein the second layer includes a carbide-based composite material that provides a thermal conductivity of less than 1 watt per meter-kelvin in a direction that is generally perpendicular to the outer surface of the IHS chassis, while providing a thermal conductivity of at least 100 W/mK in directions that are generally parallel to the outer surface of the chassis base;
• bonding the carbide-based composite material to the first layer oxidized surface such that the chassis base includes the outer surface provided by the first layer and the second layer located immediately adjacent the IHS housing.